Abstract :
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This paper review various techniques used these days to
remove errors which arise because of Electro-static Discharge (ESD)
in proper working of IC circuit. According to an estimate, ESD
accounts for more than 40% of total failure of integrated circuits. The
sources of ESD, causes and types of failure are briefly discussed in
this paper. The three mostly used devices and their use in protecting
internal circuit from ESD with some of the possible circuit design has
been explained. Starting from diode based protection circuit design to
more complex MOSFET based two stages ESD protection design and
substrate triggered Field Oxide Device (FOD) design, are reviewed
and compared. The possible protection circuit design for output
circuit is also discussed.
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